Numerical Study on Heat Transfer Characteristic of the Plate-Fin Microchannel Heat Sink for Water-Based Thermal Management of CPU Chip

For effective water-based thermal management of high heat generating CPU chip, a series numerical simulation has been conducted to study the effects flux, fin height and flow rate on convective performance plate-fin microchannel sinks. The characteristics transfer resistance have quantificationally discussed JF factor is employed evaluate comprehensive efficiency sink. Results show that increase in cooling water helpful decrease maximum temperature chip. Large flux short are benefit improve Nusselt number Nu, but they lead large coefficient fRe simultaneously. Analysis shows with fins better when power chip small. should be heightened operating at higher power. employment present work its pertinence convenience application design